Capacitor component

ABSTRACT

A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to Korean PatentApplication No. 10-2019-0082075 filed on Jul. 8, 2019 in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a capacitor component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a capacitor component, hasadvantages such as compactness, guaranteed high capacitance, and ease ofmountability.

Recently, ceramic electronic components, in detail, multilayercapacitors, have significantly increased in capacitance. To securecapacitance, an effective margin and a thickness of a cover, anelectrode terminal, or the like, should be decreased. However, such astructural change may cause a deterioration in moisture resistancereliability.

In addition, defects may occur in an electrode terminal and an internalstructure of a body due to permeation of a plating solution during aplating process, which may cause a deterioration in reliability, indetail, a deterioration in characteristics and failure of a finalproduct during high temperature/high pressure driving.

SUMMARY

An aspect of the present disclosure is to provide a capacitor componentwhich may have improved moisture resistance reliability and may preventpermeation of a plating solution during a process and/or permeation ofexternal moisture during driving of a product.

According to an aspect of the present disclosure, a capacitor componentincludes a body including dielectric layers, first and second internalelectrodes, laminated in a first direction, facing each other, and firstand second cover portions, disposed on outermost portions of the firstand second internal electrodes, and first and second externalelectrodes, respectively disposed on both external surfaces of the bodyin a second direction, perpendicular to the first direction, andrespectively connected to the first and second internal electrodes. Anindentation is disposed at at least one of boundaries between the firstinternal electrodes and the first external electrode or one ofboundaries between the second internal electrodes and the secondexternal electrode.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a capacitor componentaccording to an embodiment in the present disclosure;

FIG. 2 is a schematic perspective view of a body of FIG. 1;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1;

FIG. 4 is a cross-sectional view in X and Y directions of FIG. 1, andillustrates a cross section in which a first internal electrode isvisible;

FIG. 5 is a cross-sectional view in X and Y directions of FIG. 1, andillustrates a cross section in which a second internal electrode isvisible;

FIG. 6 is an enlarged view of portion A of FIG. 3;

FIG. 7 is a schematic diagram of an internal electrode according to anembodiment in the present disclosure;

FIG. 8 is a schematic diagram of an internal electrode according toanother embodiment in the present disclosure;

FIG. 9 is a cross-sectional view of a capacitor component according toan embodiment in the present disclosure; and

FIG. 10 is an enlarged view of portion B of FIG. 9.

DETAILED DESCRIPTION

Hereinafter, example embodiments in the present disclosure will now bedescribed in detail with reference to the accompanying drawings. Thepresent disclosure may, however, be exemplified in many different formsand should not be construed as being limited to the specific embodimentsset forth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the disclosure to those skilled in the art. In the drawings,the shapes and dimensions of elements may be exaggerated for clarity.Further, in the drawings, elements having the same functions within thesame scope of the inventive concept will be designated by the samereference numerals.

Throughout the specification, when a component is referred to as“comprise” or “comprising,” it means that it may include othercomponents as well, rather than excluding other components, unlessspecifically stated otherwise.

In the drawings, a Z direction defined as a first direction, a Tdirection, or a thickness direction, an X direction may be defined as afirst direction, an L direction, or a length direction, and a Ydirection may be defined as a second direction, a W direction, or awidth direction.

Hereinafter, a capacitor component according to an example embodiment inthe present disclosure will be described in detail with reference toFIGS. 1 to 7.

A capacitor component 100 according to the present disclosure includes abody 110 including a dielectric layer 111, first and second internalelectrodes 121 and 122, laminated in a first direction (a Z direction),opposing each other, and first and second cover portions, disposed onoutermost portions of the first and second internal electrodes 121 and122, and first and second external electrodes 131 and 132, respectivelydisposed on both external surfaces of the body 110 in a second direction(an X direction), perpendicular to the first direction (the Zdirection), and respectively electrically connected to the first andsecond internal electrodes 121 and 122. Indentations, such as grooveportions, may be disposed at at least one of a boundary between thefirst internal electrode 121 and the first external electrode 131 and aboundary between the second internal electrode 122 and the secondexternal electrode 132, and may include a glass.

FIGS. 4 and 5 illustrate indentations 151 and 152. Referring to FIGS. 4and 5, the indentation 151 is disposed at a boundary between the firstinternal electrode 121 and the first external electrode 132, and theindentation 152 may be disposed at a boundary between the secondinternal electrode 122 and the second external electrode 132. A methodof forming the indentations 151 and 152 is not limited. For example, theindentations 151 and 152 may be formed by adjusting a composition and/ora content of a metal, included in an internal electrode, and using asintering rate different from a ceramic layer during a sinteringprocess. Alternatively, the indentations 151 and 152 may be formed byadjusting a content of a glass material, included in an externalelectrode, and using the glass material exuded when the externalelectrode is sintered. Such an indentation may serve to significantlyreduce occurrence of a defect in spite of permeation of externalmoisture while maintaining a contact with an external electrode.

The indentation may be formed in at least one of the boundary betweenthe first internal electrode 121 and the first external electrode 131and the boundary between the second internal electrode 122 and thesecond external electrode 132.

In an example, the indentations 151 and 152 may be disposed at anoutermost boundary of the body 110 in the first direction among theboundary between the first internal electrode 121 and the first externalelectrode 131 and the boundary between the second internal electrode 122and the second external electrode 132. In other words, the indentations151 and 152 may be disposed in two locations corresponding to innermostelectrodes 121 and 122 farthest away from the inner electrodes 121 and122 included in the body 110, and the indentations 151 and 152 maybedisposed in the uppermost and lowermost internal electrodes 121 and 122among the internal electrodes 121 and 122 of the body 110.

FIG. 7 is a schematic diagram of a dielectric layer and an internalelectrode included in a body according to the present embodiment.Referring to FIG. 7, indentations 151 and 152 may be present in anoutermost boundary of a body 110 in a first direction, among a boundarybetween a first internal electrode 121 and a first external electrode131 and a boundary between a second internal electrode 122 and a secondexternal electrode 132. For example, indentations 151 and 152 may bepresent in only outermost boundaries of a body 110 in a first direction,among boundaries between first internal electrodes 121 and a firstexternal electrode 131 or boundaries between second internal electrodes122 and a second external electrode 132. As described above, theindentations 151 and 152 may be disposed in the outermost boundary ofthe body 110 in the first direction 110, among the boundary between afirst internal electrode 121 and a first external electrode 131 and theboundary between a second internal electrode 122 and a second externalelectrode 132, such that moisture resistance reliability of an outermostregion, to which a plating solution and external moisture are most aptto permeate, maybe improved.

In another example, the indentations 251 and 252 may be disposed at aboundary between the first internal electrode 221 and the first externalelectrode 131 and a boundary between the second internal electrode 222and the second external electrode 132, and may be disposed in both theboundaries. FIG. 8 is a schematic view illustrating a dielectric layerand the internal electrode included in the body according to the presentembodiment. Referring to FIG. 8, indentations may be disposed inboundaries where all of the first and second internal electrodes 221 and222 and the first and second external electrodes 131 and 132, includedin a body 110, meet. In other words, an indentation may be formed on thefirst and second internal electrodes 221 and 222 exposed in a seconddirection (an X direction). In this case, reliability of moistureresistance against permeation of external moisture may be significantlyimproved.

In an embodiment, the sum of widths of the indentations 151 and 152 ofthe first internal electrode 121 or the second internal electrode 122may range from 30% to 80% of an overall width of the first internalelectrode 121 or the second internal electrode 122. The sum of thewidths of the grooves of the first internal electrode 121 may refer to alength obtained by adding all widths of the grooves 151 formed in thefirst internal electrode 121 in a third direction (a W direction), andmay refer to, for example, the sum of widths of the indentations 151formed in a surface of the first internal electrode 121 closest to thefirst external electrode 131. In addition, the sum of the widths of thegrooves 152 of the second internal electrodes 122 may refer to a lengthobtained by adding all widths of the grooves 152 formed in the secondinternal electrodes 122 in the third direction (the W direction), andmay refer to, for example, the sum of widths of the indentations 152formed on a surface of the second internal electrode 122 closest to thesecond external electrode 132. The overall width of the first internalelectrode 121 or the second internal electrode 122 may refer to a lengthof the first internal electrode and the second internal electrode in theY direction, and may correspond to a length obtained by adding a widthof a portion, in which the first internal electrode are in contact withthe first external electrode, and the sum of the widths of theindentations 151, or correspond to a length obtained by adding a widthof a portion, in which the second internal electrode is in contact withthe second external electrode, and the sum of the widths of theindentations 152. When the sum of the widths of the indentations 151 ofthe first internal electrode 121 o with respect to the overall width ofthe first internal electrode 121 or the sum of the widths of theindentations 152 of the second internal electrode 122 with respect tothe overall width of the second internal electrode 122 satisfies theabove range, occurrence of a defect, caused by permeation of externalmoisture, may be significantly reduced.

In an embodiment, each of the grooves 151 and 152 may have a dimensiont1 of 5 μm or less. The dimension tl of each of the grooves 151 and 152may refer to a dimension of each of the grooves 151 and 152 in a seconddirection (an X direction). FIGS. 4 and 6 are schematic diagramsillustrating a dimension t1 of an indentation according to the presentembodiment. Referring to FIGS. 4 and 6, when viewed in the Y direction,the dimension tl of the groove may refer to a length at which aninternal electrode and an external electrode are not in contact witheach other. When the dimension of each of the grooves 151 and 152 isgreater than 5 μm, contactability between the internal electrodes 121and 122 and the external electrodes 131 and 132 may be deteriorated. Alower limit of the dimension of each of the grooves 151 and 152 is notlimited, but may be, for example, greater than 0 μm. For example, thelower limit of the dimension t1 of each of the grooves 151 and 152 maybe 0.01 μm or more. When the grooves do not exist or the lower limit ofthe dimension of each of the grooves 151 and 152 is less than the aboverange, contactability failure between the internal electrodes 121 and122 and the external electrodes 131 and 132 may occur and the moistureresistance reliability may be deteriorated.

In an embodiment, the body 110 may include a dielectric layer 111, firstand second internal electrodes 121 and 122, and first and second coverportions.

A detailed shape of the body 110 is not limited to any specific shape.However, as illustrated, the body 110 may have a hexahedral shape or ashape similar thereto. Due to shrinkage of ceramic powder particlesincluded the body 110 during a sintering process, the body 110 may havea substantially hexahedral shape rather than an exact hexahedron havingcompletely straight lines. The body 110 may have first and secondsurfaces S1 and S2 opposing each other in a thickness direction (a Zdirection), third and fourth surfaces S3 and S4, connected to the firstand second surfaces S1 and S2, opposing each other in a length direction(an X direction), and fifth and sixth surfaces S5 and S6, connected tothe first and second surfaces S1 and S2 as well as to the third andfourth surfaces S3 and S4, opposing each other in a width direction (a Ydirection).

The body 110 may be formed by alternately laminating a ceramic greensheet, on which the first internal electrode 121 is printed, and aceramic green sheet, on which the second internal electrode 122 isprinted, on the dielectric layer 111 in the thickness direction (the Zdirection).

In an example, the dielectric layers 111 and the internal electrodes 121and 122 may be alternately laminated in the first direction. A pluralityof dielectric layers 111 may be in a sintered state, and adjacentdielectric layers 111 may be integrated with each other such thatboundaries therebetween are not readily apparent without using ascanning electron microscope (SEM).

According to an embodiment, a material of the dielectric layer 111 isnot limited to any particular material as long as sufficient capacitancecan be obtained therefrom. For example, the material of the dielectriclayer 111 may be a barium titanate-based material, a lead compositeperovskite-based material, a strontium titanate-based material, or thelike.

In addition, various ceramic additives, organic solvents, plasticizers,binders, dispersants, and the like, may be added to the powder particlessuch as barium titanate (BaTiO₃), or the like, depending on the objectof the present disclosure.

For example, the dielectric layer 111 may be formed by applying anddrying slurries, formed to include powder particles such as bariumtitanate (BaTiO₃), on a carrier film to prepare a plurality of ceramicsheets. The ceramic sheet maybe formed by mixing ceramic powderparticles, a binder, and a solvent to prepare slurries and forming theslurries into a sheet type having a thickness of several micrometers(μm) by a doctor blade method, but a method of forming the ceramic sheetis not limited thereto.

In an example, an average thickness of the dielectric layer 111 may be0.4 μm or less. The average thickness of the dielectric layer 111 may bean average of values measured in five different points of the sintereddielectric layer 111. A lower limit of the average thickness of thedielectric layer 111 is not limited, but may be, for example, 0.01 μm ormore.

In an example, a plurality of internal electrodes 121 and 122 may bedisposed to oppose each other with the dielectric layer 111 interposedtherebetween. The internal electrodes 121 and 122 may include a firstinternal electrode 121 and a second internal electrode 122, which arealternately disposed to oppose each other with the dielectric layer 111therebetween.

The first internal electrode 121 may be exposed to one surface of thebody 110 in the second direction (the X direction) and a portion,exposed to one surface of the body 110 in the second direction (the Xdirection), may be connected to the first external electrode 131. Thesecond internal electrode 122 may be exposed to the other surface of thebody 110 in the second direction (the X direction) and a portion,exposed to the other surface of the body 110 in the second direction(the X direction), may be connected to the external electrode 132. Thefirst and second internal electrodes 121 and 122 may be electricallyseparated from each other by the dielectric layer 111 disposedtherebetween.

A material of the first and second internal electrodes 121 and 122 isnot limited, and the first and second internal electrodes 121 and 122may be formed using a conductive paste including at least one, forexample, silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel(Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium(Ti), or alloys thereof. As the printing method of the conductive pastemay be a screen-printing method, a gravure printing method, or the like,but is not limited thereto.

An average thickness of the first and second internal electrodes 121 and122 may be 0.4 μm or less. The average thickness of the internalelectrode maybe an average of values measured in five differentlocations of a sintered internal electrode. A lower limit of the averagethickness of the first and second internal electrodes 121 and 122 is notlimited, but may be, for example, 0.01 μm or more.

In an embodiment, first and second cover portions 123 and 124 may bedisposed on the outermost sides of the first and second internalelectrodes 121 and 122. The first and second cover portions 123 and 124may be disposed below a lowermost internal electrode of the body 110 andabove an uppermost internal electrode of the body 110, respectively. Inthis case, the lower and upper cover portions 123 and 124 may be formedof the same composition as the dielectric layer 111, and may be formedby respectively laminating one or more dielectric layers, each includingno internal electrode, on the uppermost internal electrode and thelowermost internal electrode of the body 110, respectively.

Basically, the first and second cover portions may serve to prevent aninternal electrode from being damaged by physical or chemical stress.

A thickness of each of the first and second cover portions is notlimited, but may be, for example, 25 μm or less. Capacitance per unitvolume of the capacitor component 100 may be improved by significantlydecreasing the thickness of each of the first and second cover portions.

In addition, a lower limit of the thickness of each of the first andsecond cover portions is not limited and may be appropriately selectedin consideration of a radius of curvature R1 of body edges on endsurfaces in first and second directions, for example, 5 μm or more.

The thickness of each of the first and second cover portion may refer toa dimension in the first direction (the Z direction) of the first andsecond cover portions.

In an example, the first external electrode 131 and the second externalelectrode 132 maybe disposed on both external surfaces of the body 110in the second direction, respectively. The first external electrode 131may be electrically connected to the first internal electrode 121, andthe second external electrode 132 may be electrically connected to thesecond internal electrode 122.

The first and second external electrodes 131 and 132 maybe disposed toextend to both external surfaces of the body 110 in the first direction(the Z direction) and to extend in the third direction (the Ydirection). In this case, the first and second external electrodes 131and 132 may extend to portions of the first and second surfaces 1 and 2of the body 110. The first and second external electrodes 131 and 132may also extend to portions of the fifth and sixth surfaces 5 and 6 ofthe body 110.

A first electrode layer 131 a as an inner layer of the first externalelectrode 131 and a second electrode layer 132 a as an inner layer ofthe second external electrode 132 may include copper (Cu) in highestcontent, but a material of the first and second electrode layers 131 aand 132 a is not limited thereto. For example, the first and secondelectrode layers 131 a and 132 a may be formed using a conductive pasteincluding a glass and at least one of silver (Ag), palladium (Pd), andgold (Au), platinum (Pt), nickel (Ni), tin (Sn), tungsten (W), palladium(Pd), titanium (Ti), and alloys thereof. The conductive paste may beprinted by a screen-printing method, a gravure printing method, or thelike, but a printing method of the conductive paste is not limitedthereto. Since the first and second electrode layers are formed usingthe above-mentioned conductive paste, density of an electrode layer maybe increased by the added glass to effectively suppress permeation of aplating solution and/or external moisture while maintaining sufficientconductivity.

A glass material, included in the first and second electrode layers 131a and 132 a, may have a composition in which oxides are mixed, but isnot limited and may be at least one selected from the group consistingof silicon oxide, boron oxide, aluminum oxide, transition metal oxide,alkali metal oxide, and alkaline earth metal oxide. The transition metalmay be selected from the group consisting of zinc (Zn), titanium (Ti),copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni),the alkali metal may be selected from the group consisting of lithium(Li), sodium (Na) and potassium (K), and the alkaline earth metal may beat least one selected from the group consisting of magnesium (Mg),calcium (Ca), strontium (Sr), and barium (Ba).

In an example, a central portion of each of the first and secondelectrode layers 131 a and 132 a may have a thickness ranging from 1 μmto 10 μm. The thickness of the central portion of each of the first andsecond electrode layers 131 a and 132 a may be a value measured in anintersection of lines, connecting corners facing each other, based onthe four corners of a surface on which the external electrode is formed.When the first and second electrode layers 131 a and 132 a have athickness lower than the above range, a body of the corner portion maybe exposed. When the first and second electrode layers 131 a and 132 ahave a thickness higher than the above range, cracking may occur duringa sintering process.

In an embodiment, a plating layer 131 b of the first external electrode131 and a plating layer 132 b of the second external electrode 132 maybe disposed on the first and second electrode layers 131 a and 132 a,respectively. The plating layers 131 b and 132 b may be formed bysputtering or electric deposition, but a method of forming the platinglayers 131 b and 132 b is not limited thereto.

The plating layers 131 b and 132 b may include nickel (Ni) in highestcontent, but a material of the plating layers 131 b and 132 b is notlimited thereto. The plating layers 131 b and 132 b may include copper(Cu), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb),or alloys thereof. The plating layers 131 b and 132 b may be provided toimprove mountability with a substrate, structural reliability, externaldurability against the outside, thermal resistance, and/or equivalentseries resistance (ESR).

In an example, the thickness of the central portion of each of theplating layers 131 b and 132 b may range from 3 μm to 5 μm. Thethickness of the central portion of each of the plating layers 131 b and132 b may be a value measured in an intersection of lines, connectingcorners facing each other, based on four corners of a surface on whichthe plating layers 131 b and 132 b are formed. When each of the platinglayers 131 b and 132 b has a thickness lower than the above range,permeation of external moisture may not be effectively blocked. Wheneach of the plating layers 131 b and 132 b may have a thickness higherthan the above range, the plating layers 131 b and 132 b may beseparated due to external heat when the substrate is mounted.

FIG. 9 is a cross-sectional view of a capacitor component according toan embodiment in the present disclosure and FIG. 10 is an enlarged viewof portion B of FIG. 9.

In an embodiment shown in FIGS. 9 and 10, a metal oxide 361 may bedisposed on a boundary between the first electrode layer 331 a and theplating layer 231 b and a boundary between the second electrode layer332 a and the plating layer 332 b. The metal oxide 361 may includealuminum (Al) oxide in highest content, but a material of the metaloxide 361 is not limited thereto. The metal oxide 361 may include atleast one selected from the group consisting of magnesium (Mg),manganese (Mn), nickel (Ni), lithium (Li), silicon (Si), and titanium(Ti), barium (Ba), and alloys thereof.

The metal oxide 361 may be in the form of at least one of, for example,one or more islands formed on a surface of the corresponding electrodelayer, a plurality of metal oxide bumps, an amorphous metal oxide, and ameal oxide powder, and may have a shape in which the above forms aremixed.

The metal oxide 361 may be generated during a polishing process using ametal oxide polishing agent to remove the glass protruding on a surfaceof the electrode layer to enhance the plating connectivity, or may begenerated through wet chemical growth (for example, formation of a metaloxide and a glass-based secondary phase), partial dry physical/chemicalgrowth (PVD/CVD, or the like), or the like, on a portion of theelectrode layer before plating.

The metal oxide 361 may be disposed on boundaries between the electrodelayers 361 a and 362 a and the plating layers 361 b and 362 b to preventa chip internal defect, caused by permeation of the plating solution,and to prevent moisture from permeating due to a defect in a boundarybetween an electrode layer and a plating layer, which may contribute toimprovement in moisture resistance reliability of a capacitor component.

The metal oxide 361, disposed in the boundary between the electrodelayer and the plating layer, may have a dimension ranging from 5% to 90%with respect to an overall dimension of the boundary between theelectrode layer and the plating layer. The dimension of the metal oxide361 may be based on any one end surface of the capacitor component andmay be, for example, a value measured based on an end surfaceperpendicular to the internal electrode or a surface parallel to theinternal electrode. For example, in the end surface perpendicular to theinternal electrode with respect to the capacitor component (for example,the surface passing through the center of the capacitor component), thedimension of the metal oxide may be based on the overall dimension ofthe boundary between the external electrode and the plating layer andmay be a ratio of the dimension of the metal oxide exposed to the endsurface. The ratio may be an average of values measured in fivedifferent points of the capacitor component.

The ratio may be adjusted within a range in which there is nointerference with the plating growth, for example, 90% or less, 80% orless, 70% or less, 60% or less, 50% or less, 45% or less, 40% or less,38% or less, 37% or less, 36% or less, or 35% or less, but is notlimited thereto. In addition, a lower limit of the ratio may be, forexample, 1% or more, 2% or more, 3% or more, 4% or more, 5% or more, 6%or more, 7% or more, or 7.5% or more, but is not limited thereto. Whenthe ratio of a dimension, at which the metal oxide is present, satisfiesthe above range, discontinuity of the plating layer may not occur whileimproving the moisture resistance reliability.

Table 1 illustrates contactability, high temperature/high pressurereliability, and moisture resistance reliability depending on adimension of an indentation. Table 1 targeted a capacitor component inan indentation was formed in each internal electrodes, and targeted acapacitor component in which the sum of widths of indentations rangedfrom 30 to 80% of a width of the internal electrode. In Table 1, a case,in which contactability was out of ±30% with respect to upper and lowerlimits of reference capacitance dose, was evaluated as failure. In termsof high temperature/high pressure reliability failure, when a voltage of2 Vr was applied at 150 degrees Celsius, the number of capacitorcomponents, in which a failure occurred, among 400 samples, wasexamined. In terms of moisture resistance reliability failure, when avoltage of 1 Vr was applied at 85 degrees Celsius and 85% RH, and thenumber of capacitor components in which failure occurred, among 400samples, was examined.

TABLE 1 HIGH TEMPERATURE/ HIGH PRESSURE AND MOISTURE RESISTANCEDIMENSION OF CONTACTABILITY RELIABILITY INDENTATION (t1) FAILURE FAILURE0 μm 20/400 12/400, 15/400 5 μm 18/400 0/400, 0/400 10 μm 251/400  NOTEVALUATED

From Table 1, it can be seen that high temperature/high pressurereliability and moisture resistance reliability were furthersignificantly deteriorated when an indentation has a dimension of 0 μmthan when the indentation has a dimension of 5 μm, and contactabilityfailure was significantly increased when the indentation has a dimensionof 10 μm.

Table 2 illustrates plating connectivity and a chipping rate to apresence ratio of a metal oxide between an external electrode and aplating layer. A capacitor component of Table 2 was manufactured byphysically etching an external electrode glass using an Al₂O₃ polishingagent and performing a subsequent process after adjusting a removalratio of the polishing agent (Manner 1).

In Table 2, a ratio of a metal oxide was obtained by calculating a ratioof a dimension, occupied by Al₂O₃, to an overall dimension of a boundarybetween the external electrode and the plating layer in an end surfaceof a complete chip after a subsequent process. A frequency ofdiscontinuity of the plating layer was confirmed by randomly selecting10 manufactured capacitor components, equally dividing each of thecapacitor components to a middle portion of a body into five sections inlength and thickness directions to both end surfaces of each of thecapacitor components in a second direction, and confirming a frequencyof discontinuity of a plating layer in respective locations. The otherparameters of the samples in Table 2 were the same, without consideringprocessing errors/margins. The chipping rate was confirmed by randomlyselecting 400 manufactured capacitor components and observing anexterior of a body portion using a microscope to confirm a frequency.

TABLE 2 FREQUENCY OF RATIO OF DISCONTINUITY OF FREQUENCY METAL OXIDEPLATING LAYER OF CHIPPING  0% 2/100 8/100  5% 0/100 4/100 10% 0/1000/100 35% 0/100 0/100 95% 0/100 0/100

From Table 2, it can be seen that a frequency of discontinuity of aplating layer and a frequency of chipping are decreased when a metaloxide is present, and the discontinuity of the plating layer and thechipping are reduced when more than 5% of the metal oxide is present.

Table 3 illustrates plating connectivity and a chipping rate to apresence ratio of a metal oxide between an electrode layer and a platinglayer. A capacitor component of Table 3 was prepared by completelycoating an amorphous metal oxide on the electrode layer using a physicaldeposition manner and removing a metal oxide deposited at apredetermined rate using an Al₂O₃ polishing agent (Manner 2).

TABLE 3 FREQUENCY OF RATIO OF DISCONTINUITY OF FREQUENCY METAL OXIDEPLATING LAYER OF CHIPPING  1% 0/100 100/100   5% 0/100 9/100 10% 0/1000/100 35% 1/100 0/100 95% 100/100  0/100

From Table 3, it can be confirmed that even if a metal oxide is formedin a manner different from the Manner 1 of Table 2, chipping occurs inall chips when 1% of a metal oxide is present, discontinuity andchipping of a plating layer are reduced when 5% of a metal oxide ispresent, and continuity occurs in all plating layers when 95% of a metaloxide is present.

Table 4 illustrates high temperature/high pressure reliability andmoisture resistance reliability depending on the above manners 1 and 2.The other parameters of the samples in Table 4 were the same, withoutconsidering processing errors/margins. In terms of the hightemperature/high pressure reliability failure, when a voltage of 2 Vrwas applied at 150 degrees Celsius, the number of capacitor components,in which failure occurred, among 400 samples, was examined. In terms ofthe moisture resistance reliability, when a voltage of 1 Vr was appliedat 85 degrees Celsius and 85% RH, and the number of capacitorcomponents, in which failure occurred, among 400 samples, was examined.

TABLE 4 HIGH TEMPERATURE/ MOISTURE HIGH PRESSURE RESISTANCE RELIABILITYRELIABILITY CLASSIFICATION FAILURE FAILURE NOT APPLY 5/400 8/400 MANNERS1 AND 2 APPLY MANNER 1 0/400 0/400 APPLY MANNER 2 0/400 0/400

From Table 4, it can be seen that Manner 1 (a glass of an externalelectrode portion of a manufactured capacitor component is physicallyetched and a ratio of a polishing agent is adjusted) and Manner 2 (anamorphous metal oxide is deposited on an external electrode of acapacitor component and the deposited metal oxide is removed at aconstant rate) exhibit improved high temperature/high pressurereliability and improved moisture resistance reliability even if a ratioof a metal oxide is adjusted in different manners. As a result, it isconfirmed that high temperature/high pressure reliability and moistureresistance reliability of a capacitor component according to the presentdisclosure are not changed depending on a manufacturing method, but areimproved depending on a presence ratio of a metal oxide.

As described above, according to an embodiment, an indentation may bedisposed at a boundary between an internal electrode and an externalelectrode to significantly reduce a defect, caused by permeation ofexternal moisture, while securing contactability with the externalelectrode.

According to another embodiment, an indentation maybe disposed betweenan internal electrode and an external electrode at a predetermined sizeand a predetermined ratio to prevent reliability of an electroniccomponent from being deteriorated by permeation of a plating solution ormoisture.

According to another embodiment, a meal oxide may be disposed on aboundary between an electrode layer and a plating layer to preventcracking caused by an external impact or the like.

According to another embodiment, a metal oxide layer maybe disposedbetween an electrode layer and a plating flayer to improve moistureresistance reliability.

While example embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A capacitor component comprising: a bodyincluding dielectric layers, first and second internal electrodes,laminated in a first direction, facing each other, and first and secondcover portions, disposed on outermost portions of the first and secondinternal electrodes; and first and second external electrodes,respectively disposed on both external surfaces of the body in a seconddirection, perpendicular to the first direction, and respectivelyconnected to the first and second internal electrodes, wherein pluralindentations are disposed at at least one of boundaries between at leastone of the first internal electrodes and the first external electrode orone of boundaries between at least one of the second internal electrodesand the second external electrode.
 2. The capacitor component of claim1, wherein the plural indentations are disposed at outermost boundariesof the body in the first direction, among the boundaries between thefirst internal electrodes and the first external electrode and theboundaries between the second internal electrodes and the secondexternal electrode.
 3. The capacitor component of claim 1, wherein theplural indentations are disposed at boundaries between the firstinternal electrodes and the first external electrode and boundariesbetween the second internal electrodes and the second externalelectrode.
 4. The capacitor component of claim 1, wherein a sum ofwidths of the plural indentations in one of the first and secondinternal electrodes ranges from 30% to 80% of an overall width of theone of the first and second internal electrode.
 5. The capacitorcomponent of claim 1, wherein at least one of the plural indentationshas a dimension of 5 μm or less.
 6. The capacitor component of claim 1,wherein each of the dielectric layers has an average thickness of 0.4 μmor less.
 7. The capacitor component of claim 1, wherein the first andsecond cover portions have an average thickness of 0.4 μm or less. 8.The capacitor component of claim 1, wherein each of the first and secondcover portions has a thickness of 25 μm or less.
 9. The capacitorcomponent of claim 1, wherein each of the first and second externalelectrodes comprises: an electrode layer disposed on the body and aplating layer disposed on the electrode layer.
 10. The capacitorcomponent of claim 9, wherein a metal oxide is disposed on a boundarybetween the external electrode layer and the plating layer.
 11. Thecapacitor component of claim 10, wherein the metal oxide has one of anisland, a plurality of metal oxide bumps, an amorphous metal oxide, or ametal oxide powder.
 12. The capacitor component of claim 9, wherein acentral portion of the electrode layer has a thickness ranging from 1 μmto 10 μm.
 13. The capacitor component of claim 9, wherein the electrodelayer includes a glass material.
 14. The capacitor component of claim 9,wherein a central portion of the plating layer has a thickness rangingfrom 3 μm to 5 μm.
 15. The capacitor component of claim 9, wherein theplating layer includes nickel.
 16. The capacitor component of claim 1,wherein at least one of the plural indentations includes a groove.